FINGERPRINT RECOGNITION SENSOR PACKAGE AND METHOD OF MANUFACTURING THEREOF

摘要

Disclosed is a fingerprint recognition sensor package, comprising: a base substrate; a fingerprint recognition sensor chip coupled to an upper surface of the base substrate; and a molding unit formed on the upper surface of the base substrate to seal a surrounding area of the fingerprint recognition sensor chip and configured to expose an upper surface of the fingerprint recognition sensor chip to the outside. The purpose of the present invention is to provide a fingerprint recognition sensor package mounted on an electronic device to be able to recognize a fingerprint pattern to be sensed.