发明名称 光硬化性樹脂組成物、光硬化性ドライフィルム、パターン形成方法、及び電気・電子部品保護用皮膜
摘要 PROBLEM TO BE SOLVED: To improve the properties of general negative-type photosensitive materials that produce a negative (reverse) taper shape or an overhang shape having an extremely protruding upper portion in a formed hole or space pattern, enable formation of a fine pattern in a wide wavelength range, and also enable pattern formation with high sensitivity with low light absorption in a photo-curing resin layer on a substrate itself due to high transparency in the exposure wavelength range even when the resin layer is thick.SOLUTION: A photocurable resin composition comprises: (A) a polymer composition of a weight average molecular weight of 3,000-500,000 whose base resin contains repeating units of formula (1); (B) a photo acid generator; (C) a cation of ammonium ion and an anion of an ammonium salt; (D) a crosslinking agent; and (E) a solvent.
申请公布号 JP5920229(B2) 申请公布日期 2016.05.18
申请号 JP20130010238 申请日期 2013.01.23
申请人 信越化学工業株式会社 发明人 飯尾 匡史;宮崎 隆;浦野 宏之;竹村 勝也
分类号 G03F7/038;C08G77/04;G03F7/004;G03F7/075;G03F7/40;H05K3/28 主分类号 G03F7/038
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