| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate manufacturing apparatus that is able to form a thin film pattern by eliminating or reducing the influence of an air current passing through a through-hole even if the through-hole is formed in a substrate.SOLUTION: A substrate is held on the holding surface of a stage. A nozzle head opposite the substrate held on the stage emits a droplet of a thin film material toward the substrate. A plurality of suction passages opening in the holding surface are formed in the stage. A suction device sucks the substrate held on the holding surface via the suction passages. A flow rate adjustment mechanism is arranged in each of the suction passages. Based on the difference between the pressure in the upstream suction passages of the flow rate adjustment mechanism and the pressure in the downstream suction passages, the flow rate adjustment mechanism limits the cross-sections of the suction passages. |
