| 摘要 |
Disclosed is an LED package device in which colour shift due to a resin mould is prevented. An LED package device comprises at least three or more LEDs (2R, 2B, 2G) having different wavelengths, and a lead frame (1) on which the LEDs (2R, 2B, 2G) are mounted. The lead frame (1) is provided with a cap section (5) on which the LEDs (2R, 2B, 2G) are mounted. A first optically transparent resin mould (11) is provided in the cap section (5) on which the LEDs (2R, 2B, 2G) are mounted, so as to cover the mounted LEDs (2R, 2B, 2G). A second optically transparent resin mould (12) is formed so as to cover at least an aperture of the cap section (5). The first resin mould (11) and the second resin mould (12) have mutually different refractive indices. As a result, colour shift is effectively prevented and excellent colour reproducibility is achieved when the LED package device is used in a colour display or the like. |
