PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a printed circuit board which comprises: a glass plate; a resin insulation unit formed to penetrate the glass plate; insulation layers arranged on one surface and the other surface of the glass plate; and vias formed to penetrate the resin insulation unit. Therefore, the printed circuit board improves adhesion force of the vias formed in a glass core structure to improve reliability.