| 摘要 |
The invention provides an electronic component installation device which can raise the production efficiency of substrates. The electronic component installation device is provided with a unit including a first component supply unit, a first carrying head, a first suction nozzle replacing machine, a first carrying head moving mechanism and a first substrate conveying part; a unit including a second component supply unit, a second carrying head, a second suction nozzle replacing machine, a second carrying head moving mechanism and a second substrate conveying part; and a control part, based on production procedures, installing electronic components on a substrate conveyed by the first substrate conveying part by using the first carrying head, and installing electronic components on a substrate conveyed by the second substrate conveying part by using the second carrying head. When types of the substrates of the electronic components installed by using the first carrying head or the second carrying head switch, based on the production procedures of the switched substrate, a suction nozzle of the first suction nozzle replacing machine and a suction nozzle of the second suction nozzle replacing machine are replaced by using the first carrying head and the second carrying head. |
