| 摘要 |
PROBLEM TO BE SOLVED: To prevent peeling between a sealing resin and an electronic element.SOLUTION: An electronic device includes: a substrate 10; electronic elements 20 fixed to the substrate 10; and a sealing member 30 which seals the electronic elements 20. Multiple openings 31 exposing the electronic elements 20 are formed at parts of regions in the sealing member 30 which are located on the electronic elements 20. The electronic device includes, for example, a semiconductor element 23 and a passive element 21 as the electronic components 20. The multiple openings 31 exposing the passive element 21 are formed in the sealing member on the passive element 21. |
