发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF
摘要 Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board according to an embodiment of the present invention comprises: a core layer made of the metal of the printed circuit board; and a build-up layer which is formed by successively stacking an insulation layer and a circuit pattern layer on both sides of the core layer with the core layer as a center. The printed circuit board according to an embodiment of the present invention can secure hardness of the core layer, and effectively discharge heat generated in a terminal formed in a build-up layer. wherein the step part is provided by a metal member coupled to the slider.
申请公布号 KR20160055539(A) 申请公布日期 2016.05.18
申请号 KR20140155469 申请日期 2014.11.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 JUNG, CHUL HWAN
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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