| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module which reduces the height while maintaining the shield effect, and to provide a manufacturing method of the electronic component module.SOLUTION: One or multiple electronic components 12 are mounted on one surface of a mounting substrate 11. A top surface of the electronic component 12 is electrically insulated. A ground electrode 16 of the mounting substrate 11 is exposed on the electronic component 12 mounting surface or a side surface of the mounting substrate 11 and includes a metal film 22 which covers the top surface and a side surface of the electronic component 12 and an exposed surface of the ground electrode 16. |
