发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING POLYIMIDE RESIN PATTERNS, AND PATTERNED POLYIMIDE RESIN FILM |
摘要 |
Provided is a positive photosensitive resin composition containing a polyimide resin that allows patterns to be satisfactorily formed by means of photolithography, and provides patterns with excellent heat resistance. Further provided is a method for forming polyimide resin patterns using the positive photosensitive resin composition. Further provided is a patterned polyimide resin film formed by means of the method for forming polyimide resin patterns. To the photosensitive resin composition are added, an (A) polyimide resin, and a (B) compound in which an imidazole compound having a specific structure is generated by the action of light. |
申请公布号 |
EP2913714(A4) |
申请公布日期 |
2016.05.18 |
申请号 |
EP20130848508 |
申请日期 |
2013.10.25 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
NODA, KUNIHIRO;CHISAKA, HIROKI;SHIOTA, DAI |
分类号 |
G03F7/039;G03F7/004;G03F7/20;G03F7/26;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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