CLEANING COMPOSITION AFTER CHEMICAL MECHANICAL POLISHING OF ORGANIC FILM AND CLEANING METHOD USING THE SAME

摘要

The present invention relates to a cleaning composition after polishing an organic film and a cleaning method using the same. The cleaning composition comprises an amine-based compound, an organic solvent, and ultrapure water while having pH value of 9 or more. The cleaning composition has excellent cleaning effect after polishing an organic film and can prevent contaminants remaining on the surface of the organic film after polishing the organic film from re-adsorbing to a brush and the organic layer. Also, the cleaning composition can minimize generation of scratches on the surface of the organic film, and can minimize deviation in the position of the contaminants remaining after cleaning.