| 摘要 |
The present invention relates to a printed circuit board and a manufacturing method thereof. More specifically, the printed circuit board according to an embodiment of the present invention comprises: an insulation layer including a circuit pattern having a groove formed therein; a metal protective layer formed by being filled in the groove; a solder resist layer formed on the insulation layer and having an opening unit for exposing the circuit pattern; and a solder bump formed in the opening unit on the solder resist layer. The printed circuit board according to an embodiment of the present invention can minimize a void or a crack phenomenon that may occur between different interfaces. |
