Adhesive film and method for encapsulating organic electronic device using same

摘要

The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for encapsulating an organic electronic device comprises: a protective film layer, a first adhesive layer, a second adhesive layer and a release film layer sequentially arranged. The peel strength (A) between the first adhesive layer and the protective film layer is lower than the peel strength (B) between the second adhesive layer and the release film layer, and the peel strength (B) between the second adhesive layer and the release film layer is lower than the peel strength (C) between the first adhesive layer and an encapsulation substrate, thus improving faults during a peeling process.

主权项

1. An adhesive film for encapsulating an organic electronic element, comprising:
a protection film; a first adhesive layer formed on the protection film; a second adhesive layer formed on the first adhesive layer; and a release film formed on the second adhesive layer, wherein the first and second adhesive layers satisfy the following General Equation 1 and General Equation 2,
C>B>A,  [General Equation 1] wherein A represents a peeling strength between the first adhesive layer and the protection film, B represents a peeling strength between the second adhesive layer and the release film, and C represents a peeling strength between the first adhesive layer and an encapsulation substrate after the protection film is removed, and
B−A≧5gf/25 mm.  [General Equation 2]