Semiconductor light emitting diode and method for manufacturing the same

摘要

A semiconductor light emitting diode is provided. The semiconductor light emitting diode comprises a metal electrode; an n-type cladding over the metal electrode, the n-type cladding comprising a pillar support part formed of an n-type semiconductor material, and a pillar part having a plurality of pillars formed of an n-type semiconductor material over the pillar support part; an active part conformally formed over the pillar part so as to enclose the pillar part and over the pillar support part between the pillar parts, the active part having a quantum well layer and a barrier layer stacked alternately; a p-type cladding conformally formed of a p-type semiconductor material over the active part; and a transparent electrode formed over the p-type cladding.

主权项

1. A semiconductor light emitting diode comprising:
a pair of electrodes comprising a metal electrode and a transparent electrode, wherein the transparent electrode is disposed at a distance over the metal electrode; an n-type cladding over the metal electrode, the n-type cladding comprising a pillar support part formed of an n-type semiconductor material, and a plurality of pillars formed of an n-type semiconductor material over the pillar support part, wherein a height of the plurality of pillars exceeds a width of each pillar of the plurality of pillars, and wherein the pillar support part is disposed between the metal electrode and the plurality of pillars; an active part conformally formed over the plurality of pillars so as to enclose the plurality of pillars and over the pillar support part between the plurality of pillars, the active part having a quantum well layer and a barrier layer stacked alternately; and a p-type cladding conformally formed over the active part, the p-type cladding formed of a p-type semiconductor material, wherein the plurality of pillars formed of the n-type semiconductor material, the active layer formed over the plurality of pillars and over the pillar support part, and the p-type cladding formed over the active part constitute a plurality of columns, wherein the plurality of columns are configured to maintain a space between each column of the plurality, and wherein the transparent electrode is disposed over the plurality of columns, the transparent electrode physically touching only an uppermost surface of each column of the plurality of columns.