发明名称 Thin film transistor substrate and manufacturing method thereof
摘要 A TFT substrate includes a TFT including a source electrode having a lower source electrode and an upper source electrode, which are electrically connected to each other, and a drain electrode having a lower drain electrode and an upper drain electrode, which are electrically connected to each other. The lower source electrode and the lower drain electrode are in contact with a lower surface of the semiconductor film, and the upper source electrode and the upper drain electrode are in contact with an upper surface of the semiconductor film.
申请公布号 US9343487(B2) 申请公布日期 2016.05.17
申请号 US201514839470 申请日期 2015.08.28
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 Nagayama Kensuke;Inoue Kazunori;Ito Yasuyoshi;Ishiga Nobuaki;Tsumura Naoki;Yano Shinichi
分类号 H01L21/48;H01L27/12;H01L29/423;H01L29/66;H01L29/786 主分类号 H01L21/48
代理机构 Studebaker & Brackett PC 代理人 Studebaker & Brackett PC
主权项 1. A manufacturing method of a thin film transistor substrate comprising the steps of: (a) forming a gate electrode and an auxiliary capacitance electrode on a substrate by using a first conductive film; (b) forming a first insulating film to cover said gate electrode and said auxiliary capacitance electrode; (c) forming a lower source electrode, a lower drain electrode, and a pixel electrode connected to said lower drain electrode on said first insulating film by using a second conductive film; (d) forming a semiconductor film, which is electrically connected to said lower source electrode and said lower drain electrode, on said lower source electrode and said lower drain electrode; (e) forming a second insulating film on said lower source electrode, said lower drain electrode, and said semiconductor film; and (f) forming an upper source electrode electrically connected to said semiconductor film and said lower source electrode through a contact hole, an upper drain electrode electrically connected to said semiconductor film and said lower drain electrode through a contact hole, and a common electrode electrically connected to said auxiliary capacitance electrode through a contact hole, the upper source electrode, the upper drain electrode, and the common electrode being formed on said second insulating film by using a third conductive film.
地址 Tokyo JP