发明名称 |
Thin film transistor substrate and manufacturing method thereof |
摘要 |
A TFT substrate includes a TFT including a source electrode having a lower source electrode and an upper source electrode, which are electrically connected to each other, and a drain electrode having a lower drain electrode and an upper drain electrode, which are electrically connected to each other. The lower source electrode and the lower drain electrode are in contact with a lower surface of the semiconductor film, and the upper source electrode and the upper drain electrode are in contact with an upper surface of the semiconductor film. |
申请公布号 |
US9343487(B2) |
申请公布日期 |
2016.05.17 |
申请号 |
US201514839470 |
申请日期 |
2015.08.28 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
Nagayama Kensuke;Inoue Kazunori;Ito Yasuyoshi;Ishiga Nobuaki;Tsumura Naoki;Yano Shinichi |
分类号 |
H01L21/48;H01L27/12;H01L29/423;H01L29/66;H01L29/786 |
主分类号 |
H01L21/48 |
代理机构 |
Studebaker & Brackett PC |
代理人 |
Studebaker & Brackett PC |
主权项 |
1. A manufacturing method of a thin film transistor substrate comprising the steps of:
(a) forming a gate electrode and an auxiliary capacitance electrode on a substrate by using a first conductive film; (b) forming a first insulating film to cover said gate electrode and said auxiliary capacitance electrode; (c) forming a lower source electrode, a lower drain electrode, and a pixel electrode connected to said lower drain electrode on said first insulating film by using a second conductive film; (d) forming a semiconductor film, which is electrically connected to said lower source electrode and said lower drain electrode, on said lower source electrode and said lower drain electrode; (e) forming a second insulating film on said lower source electrode, said lower drain electrode, and said semiconductor film; and (f) forming an upper source electrode electrically connected to said semiconductor film and said lower source electrode through a contact hole, an upper drain electrode electrically connected to said semiconductor film and said lower drain electrode through a contact hole, and a common electrode electrically connected to said auxiliary capacitance electrode through a contact hole, the upper source electrode, the upper drain electrode, and the common electrode being formed on said second insulating film by using a third conductive film. |
地址 |
Tokyo JP |