Magnetic field shielding for packaging build-up architectures

摘要

Magnetic field shielding material with high relative permeability incorporated into a build-up package, for example to restrict a field of a magnet integrated with the build-up to a target device configured to operate in the field. In embodiments, a first device is physically coupled to the build-up. In embodiments, a magnetic field shielding material is disposed in contact with the build-up and in proximity to the first device to restrict a magnetic field either to a region occupied by the first device or to a region exclusive of the first device. A field shielding material may be disposed within build-up near a permanent magnet also within the build-up to reduce exposure of another device, such as an IC, to the magnetic field without reducing MEMS device exposure.

主权项

1. An apparatus comprising:
a packaging build-up, the build-up including a plurality of alternating layers of patterned conductive material and insulating material; a permanent magnet physically coupled to the build-up; a first device physically coupled to the build-up and electrically coupled to at least one of the conductive material layers; and a magnetic field shielding material disposed in contact with the build-up and in proximity to the first device or magnet.