Sealing structure, device, and method for manufacturing device

摘要

Provided is a device in which heat conduction from a sealant to a functional element is suppressed and whose bezel is slim. The sealing structure includes a first substrate, a second substrate whose surface over which a sealed component is provided faces the first substrate, and a frame-like sealant which seals a space between the first substrate and the second substrate with the first substrate and the second substrate. The second substrate includes a groove portion between the sealant and the sealed component. The groove portion is in a vacuum or includes a substance whose heat conductivity is lower than that of the second substrate.

主权项

1. A device comprising:
a first substrate comprising a groove portion; an object over the first substrate; a second substrate over the object; and a sealant between the first substrate and the second substrate and surrounding the object and the groove portion, wherein the groove portion is located between the object and the sealant, and wherein at least part of a surface of the groove portion is exposed.