| 发明名称 | Hollow metal pillar packaging scheme | ||
| 摘要 | An integrated circuit includes a bottom substrate, a metal layer disposed over the bottom substrate and a hollow metal pillar disposed on the metal layer. The metal layer and the hollow metal pillar are electrically connected. | ||
| 申请公布号 | US9343417(B2) | 申请公布日期 | 2016.05.17 |
| 申请号 | US201314030157 | 申请日期 | 2013.09.18 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Huang Chang-Pin;Tu Hsien-Ming;Chen Hsien-Wei;Shao Tung-Liang;Yang Ching-Jung;Lai Yu-Chia |
| 分类号 | H01L23/48;H01L23/52;H01L29/40;H01L23/00;H01L23/31;H01L21/56;H01L23/29 | 主分类号 | H01L23/48 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. An integrated circuit, comprising: a bottom substrate; a metal layer disposed over the bottom substrate; and a hollow metal pillar disposed on the metal layer, and a stress buffer layer inside the hollow metal pillar and surrounding the hollow metal pillar wherein the metal layer and the hollow metal pillar are electrically connected. | ||
| 地址 | Hsin-Chu TW | ||