Semiconductor component with integrated crack sensor and method for detecting a crack in a semiconductor component

摘要

A first embodiment relates to a semiconductor component. The semiconductor component has a semiconductor body with a bottom side and a top side spaced distant from the bottom side in a vertical direction. In the vertical direction, the semiconductor body has a certain thickness. The semiconductor component further has a crack sensor configured to detect a crack in the semiconductor body. The crack sensor extends into the semiconductor body. A distance between the crack sensor and the bottom side is less than the thickness of the semiconductor body.

主权项

1. A semiconductor component, comprising:
a semiconductor body having a bottom side, a top side spaced distant from the bottom side in a vertical direction, and a thickness in the vertical direction; and a crack sensor configured to detect a crack in the semiconductor body, wherein
the crack sensor extends into the semiconductor body,a distance between the crack sensor and the bottom side is less than the thickness of the semiconductor body,the crack sensor is partially or completely arranged in a trench formed in the semiconductor body.