发明名称 Substrate treatment method
摘要 A substrate having a native oxide film formed on its surface is heated in a hydrogen atmosphere to reduce silicon dioxide to hydrogen. Additionally, silicon near an interface between the native oxide film and the substrate is hydrogen-terminated. A hydrogen-introduced layer containing silicon bonded with hydrogen is accordingly formed on the substrate surface. A dopant solution is supplied to the substrate surface having the hydrogen-introduced layer formed thereon, and hydrogen in the hydrogen-introduced layer is replaced with a dopant, thereby introducing the dopant into the substrate surface. A relatively large thickness of the hydrogen-introduced layer formed through the reduction of the native oxide film allows the dopant to be uniformly introduced into the substrate surface for a required depth. A flashing light is emitted to the substrate surface containing the introduced dopant, activating the dopant.
申请公布号 US9343311(B2) 申请公布日期 2016.05.17
申请号 US201314408390 申请日期 2013.06.05
申请人 SCREEN Holdings Co., Ltd. 发明人 Kato Shinichi
分类号 H01L21/30;H01L21/228;H01L21/02;H01L21/306;H01L21/324;H01L21/268;H01L21/67 主分类号 H01L21/30
代理机构 Ostrolenk Faber LLP 代理人 Ostrolenk Faber LLP
主权项 1. A substrate treatment method for introducing a dopant into a surface of a silicon substrate, the method comprising: a hydrogen annealing step of heating a substrate having an oxide film formed on a surface thereof in a hydrogen-containing atmosphere with the oxide film remaining thereon to reduce said oxide film with hydrogen and hydrogen-terminate silicon at an interface between said oxide film and said substrate; and an introduction step of supplying a chemical solution containing a dopant to the surface of said substrate to introduce the dopant into said surface after said hydrogen annealing step.
地址 Kyoto JP