| 摘要 |
The present invention provides a rotational wire-saw device capable of increasing a processing speed and improving the surface flatness of a cut surface. According to the present invention, the wire-saw device, cutting an ingot by using a wire, includes: a wire supply bobbin; a wire winding bobbin on which the wire, supplied from the wire supply bobbin, is wound; multiple guide rollers placed between the wire supply bobbin and the wire winding bobbin, winding the wire in a spiral shape, and inducing the wire; a nozzle supplying cutting liquid to the wire; a holder to which the ingot is fixed; an operating part rotating the holder; and a transfer part connected with the operating part to transfer the operating part to the wire. |
