METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

The present invention relates to a method for manufacturing a semiconductor package capable of reducing manufacturing costs and making manufacturing time efficient and a semiconductor package using the same. According to an embodiment of the present invention, the method for manufacturing a semiconductor package comprises the following steps of: (A) placing a first semiconductor die and a second semiconductor die on a substrate; (B) placing a frame on the substrate to surround the first semiconductor die and the second semiconductor die respectively; and (C) encapsulating the inside of the frame by an encapsulant.