| 发明名称 | Testing holders for chip unit and die package | ||
| 摘要 | A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body. | ||
| 申请公布号 | US9341671(B2) | 申请公布日期 | 2016.05.17 |
| 申请号 | US201313830525 | 申请日期 | 2013.03.14 |
| 申请人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 发明人 | Wang Mill-Jer;Liu Kuo-Chuan;Peng Ching-Nen;Lin Hung-Chih;Chen Hao |
| 分类号 | G01R31/00;G01R31/28;G01R1/04;G01R31/3185 | 主分类号 | G01R31/00 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. A testing holder for a chip unit, comprising: a holder body containing the chip unit; and a pressure releasing device formed on the holder body to release an insertion pressure when the chip unit is inserted in the holder body, wherein the holder body comprises a bottom plate, and the chip unit includes a bottom surface facing the bottom plate and an opposing top surface on which a test contactor is disposed. | ||
| 地址 | Hsinchu TW | ||