Pattern factor dependency alleviation for eDRAM and logic devices with disposable fill to ease deep trench integration with fins

摘要

Dummy deep trenches can be formed within a logic device region in which logic devices are to be formed while deep trench capacitors are formed within a memory device region. Semiconductor fins are formed over a top surface prior to forming trenches, and disposable material is filled around said semiconductor fins. A top surface of said disposable filler material layer can be coplanar with a top surface of said semiconductor fins, which eases deep trench formation. Conductive material portions of the dummy deep trenches can be recessed to avoid electrical contact with semiconductor fins within the logic device region, while an inner electrode of each deep trench can contact a semiconductor fin within the memory device region. A dielectric material portion can be formed above each conductive material portion of a dummy deep trench.

主权项

1. A semiconductor structure comprising:
a dielectric material liner located within a lower portion of a trench in a substrate, wherein outer surfaces of said dielectric material liner contacts surfaces of a buried plate comprising a doped semiconductor material and inner surfaces of said dielectric material liner contact a conductive material portion, said conductive material portion defining, in part, a trench capacitor embedded within said substrate; a trench top dielectric portion located within an upper portion of said trench and contacting said dielectric material liner and an entirety of a top surface of said conductive material portion; and an insulator layer laterally contacting sidewalls of said trench top dielectric portion and said dielectric material liner, wherein said conductive material portion defining, at least in part, an inner electrode of said trench capacitor is encapsulated by said dielectric material liner, said trench top dielectric portion, and a sidewall of said insulator layer.