发明名称 |
Etching method for surface structuring |
摘要 |
An etching method for selective introduction of structures into surfaces of different substrates, such as glass or glass ceramic substrates, is provided. The method provides for surface structuring using an etch mask. The etchmask allows for the production of very fine structures on the substrate surfaces using liquid etching media. In this method the etch mask is produced on the substrate. |
申请公布号 |
US9340450(B2) |
申请公布日期 |
2016.05.17 |
申请号 |
US201113299544 |
申请日期 |
2011.11.18 |
申请人 |
SCHOTT AG |
发明人 |
Rudigier-Voigt Eveline;Bockmeyer Matthias |
分类号 |
C03C15/00;H01L21/308;H01L21/768;G03F7/004;C03C19/00;B44C1/22 |
主分类号 |
C03C15/00 |
代理机构 |
Ohlandt, Greeley, Ruggiero & Perle, LLP |
代理人 |
Ohlandt, Greeley, Ruggiero & Perle, LLP |
主权项 |
1. A method for the introduction of a desired structure into a surface of a substrate, comprising:
applying a masking base material onto the surface; embossing a pattern selected according to the desired structure into the masking base material with a punch; curing the masking base material in at least one curing step to provide an etch mask; and contacting a liquid etching medium with the etch mask to etch the surface of the substrate to the desired structure, wherein the etch mask does not have any holes in the area of the surface to be structured so that the liquid etching medium, immediately after contacting the etch mask, does not come into contact with the surface of the substrate. |
地址 |
Mainz DE |