发明名称 Methods of forming silicon-containing dielectric materials and semiconductor device structures
摘要 A method of forming a silicon-containing dielectric material. The method includes forming a plasma comprising nitrogen radicals, absorbing the nitrogen radicals onto a substrate, and exposing the substrate to a silicon-containing precursor in a non-plasma environment to form monolayers of a silicon-containing dielectric material on the substrate. Additional methods are also described, as are semiconductor device structures including the silicon-containing dielectric material and methods of forming the semiconductor device structures.
申请公布号 US9343317(B2) 申请公布日期 2016.05.17
申请号 US201313932667 申请日期 2013.07.01
申请人 Micron Technology, Inc. 发明人 Omstead Thomas R.;Franklin Cole S.
分类号 H01L21/283;H01L21/02;C23C16/34;C23C16/36;C23C16/455;H01L21/768;H01L45/00;H01L27/24 主分类号 H01L21/283
代理机构 TraskBritt 代理人 TraskBritt
主权项 1. A method of forming a silicon-containing dielectric material, comprising: forming a plasma comprising nitrogen radicals; chemisorbing the nitrogen radicals onto a substrate; terminating the plasma; and after chemisorbing the nitrogen radicals onto the substrate, exposing the substrate comprising the chemisorbed nitrogen to a silicon-containing precursor in a non-plasma environment to form monolayers of silicon bonded to the chemisorbed nitrogen on the substrate.
地址 Boise ID US