发明名称 |
Methods of forming silicon-containing dielectric materials and semiconductor device structures |
摘要 |
A method of forming a silicon-containing dielectric material. The method includes forming a plasma comprising nitrogen radicals, absorbing the nitrogen radicals onto a substrate, and exposing the substrate to a silicon-containing precursor in a non-plasma environment to form monolayers of a silicon-containing dielectric material on the substrate. Additional methods are also described, as are semiconductor device structures including the silicon-containing dielectric material and methods of forming the semiconductor device structures. |
申请公布号 |
US9343317(B2) |
申请公布日期 |
2016.05.17 |
申请号 |
US201313932667 |
申请日期 |
2013.07.01 |
申请人 |
Micron Technology, Inc. |
发明人 |
Omstead Thomas R.;Franklin Cole S. |
分类号 |
H01L21/283;H01L21/02;C23C16/34;C23C16/36;C23C16/455;H01L21/768;H01L45/00;H01L27/24 |
主分类号 |
H01L21/283 |
代理机构 |
TraskBritt |
代理人 |
TraskBritt |
主权项 |
1. A method of forming a silicon-containing dielectric material, comprising:
forming a plasma comprising nitrogen radicals; chemisorbing the nitrogen radicals onto a substrate; terminating the plasma; and after chemisorbing the nitrogen radicals onto the substrate, exposing the substrate comprising the chemisorbed nitrogen to a silicon-containing precursor in a non-plasma environment to form monolayers of silicon bonded to the chemisorbed nitrogen on the substrate. |
地址 |
Boise ID US |