发明名称 |
Silicon germanium and germanium multigate and nanowire structures for logic and multilevel memory applications |
摘要 |
A method to provide a transistor or memory cell structure. The method comprises: providing a substrate including a lower Si substrate and an insulating layer on the substrate; providing a first projection extending above the insulating layer, the first projection including an Si material and a Si1−xGex material; and exposing the first projection to preferential oxidation to yield a second projection including a center region comprising Ge/Si1−yGey and a covering region comprising SiO2 and enclosing the center region. |
申请公布号 |
US9343302(B2) |
申请公布日期 |
2016.05.17 |
申请号 |
US201414571579 |
申请日期 |
2014.12.16 |
申请人 |
Intel Corporation |
发明人 |
Jin Been-Yih;Doyle Brian S.;Kavalieros Jack T.;Chau Robert S. |
分类号 |
H01L21/00;H01L21/02;B82Y10/00;H01L29/06;H01L29/165;H01L29/423;H01L29/66;H01L29/775;H01L29/78;H01L29/786;H01L29/10;H01L21/306;H01L21/762;H01L21/316;H01L21/8238 |
主分类号 |
H01L21/00 |
代理机构 |
Winkle, PLLC |
代理人 |
Winkle, PLLC |
主权项 |
1. A method to form a microelectronic structure, comprising:
providing a substrate including a lower Si substrate and an insulating layer on the substrate; forming a projection on the substrate projecting above the insulating layer comprising a plurality of interleaved Si1−xGex and Si layers; and oxidizing the projection to form a plurality of nanowires and an insulation covering, wherein the insulation covering is a single structure surrounding each of the plurality of nanowires. |
地址 |
Santa Clara CA US |