发明名称 Silicon germanium and germanium multigate and nanowire structures for logic and multilevel memory applications
摘要 A method to provide a transistor or memory cell structure. The method comprises: providing a substrate including a lower Si substrate and an insulating layer on the substrate; providing a first projection extending above the insulating layer, the first projection including an Si material and a Si1−xGex material; and exposing the first projection to preferential oxidation to yield a second projection including a center region comprising Ge/Si1−yGey and a covering region comprising SiO2 and enclosing the center region.
申请公布号 US9343302(B2) 申请公布日期 2016.05.17
申请号 US201414571579 申请日期 2014.12.16
申请人 Intel Corporation 发明人 Jin Been-Yih;Doyle Brian S.;Kavalieros Jack T.;Chau Robert S.
分类号 H01L21/00;H01L21/02;B82Y10/00;H01L29/06;H01L29/165;H01L29/423;H01L29/66;H01L29/775;H01L29/78;H01L29/786;H01L29/10;H01L21/306;H01L21/762;H01L21/316;H01L21/8238 主分类号 H01L21/00
代理机构 Winkle, PLLC 代理人 Winkle, PLLC
主权项 1. A method to form a microelectronic structure, comprising: providing a substrate including a lower Si substrate and an insulating layer on the substrate; forming a projection on the substrate projecting above the insulating layer comprising a plurality of interleaved Si1−xGex and Si layers; and oxidizing the projection to form a plurality of nanowires and an insulation covering, wherein the insulation covering is a single structure surrounding each of the plurality of nanowires.
地址 Santa Clara CA US