METHOD OF MANUFACTUING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a semiconductor package, and a method for manufacturing a semiconductor package. According to an embodiment, the method includes the steps of: forming a passivation layer on a semiconductor die having a plurality of die pads formed thereon; forming a rewiring layer which is disposed on the passivation layer, and is electrically connected to the die pad by passing through the passivation layer; disposing a temporary pattern member for a bump on the rewiring layer; forming a molding part to cover the passivation layer, the rewiring layer and the temporary pattern member for a bump; grinding the molding part to expose the temporary pattern member for a bump; removing the exposed temporary pattern member for a bump; and forming a conductive bump through a cavity created by removing the temporary pattern member for a bump.