Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same

摘要

An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100 μm or smaller, in terms of the width of the exposed substrate area, and having a height of 3 μm or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100 μm or finer is formed therefrom.

主权项

1. A method for forming a microfine pattern, comprising forming one or more openings having a width of the exposed base area of 100 μm or less in a resist coating on a substrate, and immersing the resist-coated, opening-formed substrate in an electroless gold plating solution-comprising an accelerator for deposition in fine areas with a width of 100 μm or less comprising one or more compounds selected from the group consisting of polyvinyl alcohol, polyvinyl pyrrolidone, benzotriazole and 1,10-phenanthrolinium, and a gold source, thereby filling the openings with gold.