| 发明名称 | Laser marking in packages | ||
| 摘要 | A package includes a device die, a first plurality of redistribution lines underlying the device die, a second plurality of redistribution lines overlying the device die, and a metal pad in a same metal layer as the second plurality of redistribution lines. A laser mark is in a dielectric layer that is overlying the metal pad. The laser mark overlaps the metal pad. | ||
| 申请公布号 | US9343434(B2) | 申请公布日期 | 2016.05.17 |
| 申请号 | US201414192341 | 申请日期 | 2014.02.27 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Chen Hsien-Wei |
| 分类号 | H01L23/02;H01L25/065;H01L25/00;H01L23/00;H01L23/48;H01L23/544;H01L23/58;H01L21/768;H01L23/31 | 主分类号 | H01L23/02 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. A package comprising: a first package comprising: a device die;a first plurality of redistribution lines underlying the device die;a second plurality of redistribution lines overlying the device die;a metal pad in a same metal layer as the second plurality of redistribution lines; anda laser mark in a dielectric layer, wherein the dielectric layer is overlying the metal pad, and wherein the laser mark overlaps the metal pad. | ||
| 地址 | Hsin-Chu TW | ||