| 发明名称 | Method of connecting a semiconductor package to a board | ||
| 摘要 | A method of connecting a semiconductor package to a board includes providing a board having a plurality of contact regions, providing a semiconductor package having a plurality of contact areas, selecting a specific contact area out of the plurality of contact areas, applying solder balls to the contact areas and therein applying two or more specific solder balls to the specific contact area, and connecting the semiconductor package to the board in such a way that the two or more specific solder balls are connected with each other and with a contact region of the plurality of contact regions of the board. | ||
| 申请公布号 | US9343397(B2) | 申请公布日期 | 2016.05.17 |
| 申请号 | US201414191494 | 申请日期 | 2014.02.27 |
| 申请人 | Infineon Technologies AG | 发明人 | Marbella Carlo |
| 分类号 | H01L21/44;H01L23/498;H01L23/00;H05K1/11;H05K3/34 | 主分类号 | H01L21/44 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A method of connecting a semiconductor package to a board, the method comprising: providing a board, the board comprising a plurality of contact regions; providing a semiconductor package, the semiconductor package comprising a plurality of contact areas; selecting a specific contact area out of the plurality of contact areas; applying solder balls to the contact areas and therein applying two or more specific solder balls to the specific contact area; and connecting the semiconductor package to the board in such a way that the two or more specific solder balls are connected with a contact region of the plurality of contact regions of the board and are merged into each other forming a joint solder joint. | ||
| 地址 | Neubiberg DE | ||