Substrate processing method and substrate processing apparatus

摘要

A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off a liquid remaining on the substrate, and a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate.

主权项

1. A substrate processing method comprising:
a chemical liquid supplying step of supplying a chemical liquid having a first temperature to a major surface of a substrate; a rinse liquid supplying step of supplying, after the chemical liquid supplying step, a rinse liquid having a second temperature lower than the first temperature to the major surface of the substrate to rinse off the liquid remaining on the substrate; a reaction liquid supplying step of discharging, after the chemical liquid supplying step and before the rinse liquid supplying step, a reaction-liquid-containing liquid, which contains, at least at a start of discharge of itself, a reaction liquid, causing an exothermic reaction upon mixing with the chemical liquid supplied to the substrate in the chemical liquid supplying step, and a heat generating liquid, generating heat upon mixing with the reaction liquid, and has a liquid temperature not more than the first temperature and not less than the second temperature, toward the major surface of the substrate in a state where the chemical liquid supplied to the substrate in the chemical liquid supplying step remains on the substrate; and a reaction liquid concentration changing step of reducing, in parallel to the reaction liquid supplying step, a proportion of the heat generating liquid contained in the reaction-liquid-containing liquid discharged toward the substrate such that a liquid temperature of the reaction-liquid-containing liquid discharged toward the substrate decreases to a temperature lower than a liquid temperature of the reaction-liquid-containing liquid at the start of discharge of the reaction-liquid-containing liquid.