| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which can be efficiently manufactured.SOLUTION: A semiconductor module 10A according to one embodiment comprises a plurality of first and second transistor chips (hereinafter, referred to as first and second transistors) 12A, 12B and a substrate 90. In the plurality of first transistors and second transistors: first and second main electrode pads 18, 20 are electrically connected with each other, respectively; the second main electrode pads of the first transistors are electrically connected to the first main electrode pads of the second transistors; and control electrode pads of the first and second transistors are connected to first and second control electrode wiring patterns 94, 98 via first and second resistance parts 13A, 13B. The first and second resistance parts include a plurality of first and second resistive elements 72A, 72B connected with the corresponding control electrode pads and first and second linkage parts 74A, 74B for linking the plurality of first and second resistive elements.SELECTED DRAWING: Figure 1 |
