| 摘要 |
PROBLEM TO BE SOLVED: To provide a direct diode laser processing device that when performing processing using laser light with multiple wavelengths, can make an intensity distribution of light in a thickness direction of a work-piece suitable for cutting a thick plate.SOLUTION: The direct diode laser processing device comprises: a laser oscillator that oscillates laser light with multiple wavelengths; a transmitting fiber that transmits the laser light with multiple wavelengths oscillated by the laser oscillator; and a laser processing machine that condenses the laser light with multiple wavelengths transmitted by the transmitting fiber so as to process a work-piece. Based on chromatic aberration of the laser light with multiple wavelengths and wavelength dependency of emissivity of the work-piece, an intensity distribution of the light in a thickness direction of the work-piece has a plurality of peaks.SELECTED DRAWING: Figure 1 |
