发明名称 NON-SUBSTRATE TYPE TRANSFER FILM COMPRISING CONDUCTIVE LAYER AND METHOD FOR MANUFACTURING THE SAME
摘要 Disclosed are a non-substrate type transfer film comprising a conductive layer, a manufacturing method thereof, and an electronic device to which the non-substrate type transfer film is transferred. The transfer film includes: a first releasing film; a conductive layer positioned on one side of the first releasing film; an adhesive layer positioned on one side of the conductive layer; and a second releasing film positioned on one side of the adhesive layer. The non-substrate type transfer film of the present invention forms a conductive layer on electronic devices by a transfer method, and removes a plastic substrate while maintaining conductivity, thereby exhibiting effects of increasing transparency and reducing the thickness of the conductive layer.
申请公布号 KR20160054260(A) 申请公布日期 2016.05.16
申请号 KR20140153644 申请日期 2014.11.06
申请人 YOULCHON CHEMICAL CO., LTD. 发明人 WATANABE NIRO;KIM, KANG SOO;KIM, SUNG HUN;YOON, DONG KUG;JANG, NAM YOON;YOON, JHIN YEONG
分类号 B32B7/02;B32B7/06;B32B37/00;G06F3/041;H01B5/14 主分类号 B32B7/02
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