发明名称 METHOD FOR ETCHING MULTILAYERED FILM
摘要 PROBLEM TO BE SOLVED: To enable the removal of a deposit sticking to a surface having a geometry formed by etching.SOLUTION: A method according to an embodiment comprises the steps of: (a) etching an upper magnetic layer by plasma generated in a process chamber, in which the etching of the upper magnetic layer is terminated at a surface of an insulator layer; (b) removing deposits formed on surfaces of a mask and the upper magnetic layer as a result of the etching of the upper magnetic layer by plasma generated in the process chamber; and (c) etching the insulator layer by plasma generated in the process chamber. In the deposit removing step, a pulse-modulated DC voltage as a bias voltage for drawing in ions is applied to a support structure holding an object to be processed while tilting and rotating the support structure.SELECTED DRAWING: Figure 13
申请公布号 JP2016082019(A) 申请公布日期 2016.05.16
申请号 JP20140210664 申请日期 2014.10.15
申请人 TOKYO ELECTRON LTD 发明人 NISHIMURA EIICHI;OHATA MITSUTAKA
分类号 H01L43/12;H01L21/3065;H01L21/8246;H01L27/105;H01L43/08;H01L43/10 主分类号 H01L43/12
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