发明名称 |
METHOD FOR ETCHING MULTILAYERED FILM |
摘要 |
PROBLEM TO BE SOLVED: To enable the removal of a deposit sticking to a surface having a geometry formed by etching.SOLUTION: A method according to an embodiment comprises the steps of: (a) etching an upper magnetic layer by plasma generated in a process chamber, in which the etching of the upper magnetic layer is terminated at a surface of an insulator layer; (b) removing deposits formed on surfaces of a mask and the upper magnetic layer as a result of the etching of the upper magnetic layer by plasma generated in the process chamber; and (c) etching the insulator layer by plasma generated in the process chamber. In the deposit removing step, a pulse-modulated DC voltage as a bias voltage for drawing in ions is applied to a support structure holding an object to be processed while tilting and rotating the support structure.SELECTED DRAWING: Figure 13 |
申请公布号 |
JP2016082019(A) |
申请公布日期 |
2016.05.16 |
申请号 |
JP20140210664 |
申请日期 |
2014.10.15 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
NISHIMURA EIICHI;OHATA MITSUTAKA |
分类号 |
H01L43/12;H01L21/3065;H01L21/8246;H01L27/105;H01L43/08;H01L43/10 |
主分类号 |
H01L43/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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