| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling method of a resin film layer, having high productivity with low initial cost, capable of reusing a substrate after use with low cost.SOLUTION: The peeling method of a resin film layer including steps of: forming a nanoparticle layer on a support substrate; forming a resin film layer on the nanoparticle layer; and peeling the resin film layer from the support substrate.SELECTED DRAWING: Figure 1 |
