PROCESSING APPARATUS AND PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a processing apparatus and a processing method which can perform uniform processing.SOLUTION: A processing apparatus 1 comprises: a load port 2 where a transport container 21 housing a plurality of semiconductor wafers is placed; a dummy wafer storage area 3 where a transport container 31 housing a plurality of dummy wafers is placed; a device 71 for processing the plurality of semiconductor wafers in a state where the plurality of semiconductor wafers and dummy wafers are placed on a slot 80; and a control part 100 for controlling each part of the apparatus. The control part 100 determines whether the device 71 is not in a processing state and transfers the dummy wafer housed in the transport container 31 to the slot 80 when determines that the device 71 is not in the processing state and transfers the dummy wafer to the transport container 31 when the subsequent processing by the device 71 is set.SELECTED DRAWING: Figure 1