| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin composition for adhering electronic parts, which is a conductive paste having high adhesivity to a metal plated frame and hardly causes bleeding.SOLUTION: The conductive resin composition for adhering electronic parts comprises as essential components (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a fluorine-based dispersant, and (E) conductive powder. The (B) curing agent is a phenol resin. The (D) fluorine-based dispersant is contained in an amount of 0.1 to 1.5 pts.wt. relative to 100 pts.wt. of the (A) epoxy resin. The (D) fluorine-containing dispersant is an oligomer containing a fluorine-containing group, a hydrophilic group, and a lipophilic group, or the oligomer containing the fluorine-containing group and the lipophilic group.SELECTED DRAWING: None |
