| 摘要 |
PROBLEM TO BE SOLVED: To avoid exert influence on a substrate caused by the fact that an etching solution reaches a high temperature in substrate treatment where the edge faces of the substrate are subjected to etching.SOLUTION: A substrate 33 is immersed into an etching solution S stored in a treatment tank 2, and the edge face, and the edge face 33a of the substrate 33 is subjected to etching. When a circulation valve 11 is operated and a circulation pump 10 is driven, this etching solution S passes and circulates through a circulation tank 3, a storage tank 7, a cooling tank 15 and a balance tank 23 in order. At this time, cooling air A is fed to the etching solution S stored in the cooling tank 15, and the etching solution S is cooled. In this way, while avoiding bad influence on the substrate 33 caused by the fact that the etching solution S reaches a high temperature, the substrate treatment can be continuously performed.SELECTED DRAWING: Figure 1 |
