摘要 |
PROBLEM TO BE SOLVED: To provide a film excellent in all of solvent resistance, impact resistance and flowability and to provide a molding material formed of the film.SOLUTION: The film comprises a polybiphenyl ether sulphone resin having a repeating unit represented by formula (1) and a thermoplastic polyimide resin and has a content ratio of the thermoplastic polyimide resin to the total amount of the polybiphenyl ether sulphone resin and the thermoplastic polyimide resin of 30 to 50 mass%. The film has a softening temperature of 200°C or higher as measured in accordance with JIS K 7196 and a melt viscosity of 200 to 800 Pa s at a test temperature of 400°C and a shear rate of 100 sec. (a is 0 or 1; b is 0 or 1; R1 to R4 are each independently -O-, -SO2-, -S- or -C(=O)-; provided that at least one of R1 to R4 is -SO2- and at least one of R1 to R4 is -O-; and Ar1 to Ar3 are each independently a 6-24C arylene group)SELECTED DRAWING: None |