发明名称 |
POLYAMIDE RESIN COMPOSITION AND MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition that has excellent heat aging resistance, effectively inhibits metal corrosiveness and also effectively inhibits copper deposition.SOLUTION: A polyamide resin composition comprises (A) a polyamide resin, (B) a copper compound, (C) a bromide of alkali metal and/or alkaline earth metal, and (D) a metal aluminate.SELECTED DRAWING: None |
申请公布号 |
JP2016079274(A) |
申请公布日期 |
2016.05.16 |
申请号 |
JP20140211038 |
申请日期 |
2014.10.15 |
申请人 |
ASAHI KASEI CHEMICALS CORP |
发明人 |
TERADA KAZUNORI;SAKUMA TERUAKI |
分类号 |
C08L77/00;C08K3/10;C08K3/16;C08K5/098;C08K5/101;C08K5/20 |
主分类号 |
C08L77/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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