发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition that has excellent heat aging resistance, effectively inhibits metal corrosiveness and also effectively inhibits copper deposition.SOLUTION: A polyamide resin composition comprises (A) a polyamide resin, (B) a copper compound, (C) a bromide of alkali metal and/or alkaline earth metal, and (D) a metal aluminate.SELECTED DRAWING: None
申请公布号 JP2016079274(A) 申请公布日期 2016.05.16
申请号 JP20140211038 申请日期 2014.10.15
申请人 ASAHI KASEI CHEMICALS CORP 发明人 TERADA KAZUNORI;SAKUMA TERUAKI
分类号 C08L77/00;C08K3/10;C08K3/16;C08K5/098;C08K5/101;C08K5/20 主分类号 C08L77/00
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