| 摘要 |
PROBLEM TO BE SOLVED: To provide a copolyester resin for adhesive, which has further improved resistance to moisture and heat while maintaining good adhesiveness to a polyester film.SOLUTION: Provided is a copolyester resin for adhesive having a glass transition temperature of 30°C or less, comprising a dicarboxylic acid component which contains terephthalic acid and isophthalic acid as main components, and a diol component containing 30 mol% or more of a linear dihydric alcohol where a main chain has 4 or more carbon atoms and 1 to 30 mol% of a polyalkylene glycol.SELECTED DRAWING: None |
