| 摘要 |
PROBLEM TO BE SOLVED: To realize a bonding device for thin films capable of preventing a mixing of air bubbles to a bonding face of thin films.SOLUTION: A bonding device 100 for a plurality of thin films includes: a conveying part 10 for supplying the plurality of thin films to be bonded from the above to the below in the vertical direction; a thermal bonding member 20 for bonding the plurality of thin films; and an air suction member 30 disposed vertically above the thermal bonding member 20.SELECTED DRAWING: Figure 1 |
