发明名称 CUTTING TOOL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cutting tool device which includes a chuck table which can selectively suck and hold a large-sized rectangular substrate and a small-sized rectangular substrate.SOLUTION: The cutting tool device cuts a front surface or a rear surface of the rectangular substrate with a cutting tool, and includes the chuck table which sucks and holds the rectangular substrate by a rectangular holding surface. The chuck table includes: a base having a first suction port and a second suction port; a first chuck table arranged in a position corresponding to the first suction port of the base; a second chuck table arranged in a position which corresponds to the second suction port of the base and is adjacent to the first chuck table. A first rectangular substrate which has a size corresponding to one area structured by the holding surface of the first chuck table and the holding surface of the second chuck table, and a second rectangular substrate which has a size corresponding to the holding surface of the first or second chuck table can be sucked and held selectively.SELECTED DRAWING: Figure 1
申请公布号 JP2016078216(A) 申请公布日期 2016.05.16
申请号 JP20140215184 申请日期 2014.10.22
申请人 DISCO ABRASIVE SYST LTD 发明人 KAWASE MASAYUKI
分类号 B23Q3/08;B23D5/02 主分类号 B23Q3/08
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