COMPONENT PRESSURE-BONDING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a component pressure-bonding device capable of reducing occurence of defective boards due to draw-down of a picked up film component.SOLUTION: A pressure-bonding tool 21 which sucks a film component 3 and pressurizes the same to a base plate 2 has plural main suction blocks 33 which is movable along a guide 45 of the block holding part 32 and a sub suction block 34. The plural main suction blocks 33 sucks an upper part Ra of a pressure-bonding part of the film component 3, and the sub suction block 34 sucks an upper part Rb of a non-pressure-bonding part of the film component 3 with respect to the base plate 2.SELECTED DRAWING: Figure 6