| 摘要 |
PROBLEM TO BE SOLVED: To provide a press packed semiconductor device which has high reliability.SOLUTION: A semiconductor device of an embodiment comprises: a frame body which includes ceramic and which is annular and satisfies the following formula (1) when assuming that a thickness in a radial direction is t(mm) and a Young's modulus of the ceramic is E(GPa); a plurality of semiconductor elements which are provided inside the frame body and each of which has a first electrode on a fist surface and a second electrode on a second surface on the side opposite to the first surface; a first electrode block which is provided on the fist surface side and electrically connected with the first electrode; and a second electrode block which is provided on the second surface side and electrically connected with the second electrode. (2/5E)(D/t)≤17.4 (1).SELECTED DRAWING: Figure 1 |
