| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a substrate having high accuracy in dimension.SOLUTION: A method for manufacturing a substrate includes: a detection step (Step S14) for detecting a difference between a reference shape 111 and a contracted shape 112 of an insulating substrate 110 having relatively small thermal plasticity to the reference shape 111; an expansion step (Step S15) for applying tensile force to the outer peripheral edge of a circuit board 100; a heating step (Step S16) for heating the circuit board 100; and a release step (Step S18) for releasing the applied tensile force to the circuit board 100. In the expansion step (Step S15), on the basis of at least a difference A1, the insulating substrate 110 is elastically expanded so as to have an expansion shape 113.SELECTED DRAWING: Figure 7 |
