发明名称 SEMICONDUCTOR DEVICE TESTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To disclose a technique capable of sufficiently applying a load to a semiconductor device, and appropriately suppressing the progress of the breakdown of the semiconductor device when the semiconductor device is broken down.SOLUTION: A testing apparatus 2 comprises: a power supply 10; a load inductor 20; a diode 30; a device under test 40; and a cutoff device 50. The cutoff device 50 is connected between the power supply 10 and the device under test 40, and can cut off a current to the device under test 40. The cutoff device 50 starts reducing the current after a voltage applied to the device under test 40 when the device under test 40 is turned off rises up to a peak voltage and before timing at which the voltage becomes stable, and cuts off the current to the device under test 40 before the timing. An inductance of a closed circuit 90 by way of the power supply 10, the diode 30, the cutoff device 50 and the device under test 40 and a power supply voltage are adjusted so that the peak voltage exceeds a target value.SELECTED DRAWING: Figure 1
申请公布号 JP2016080518(A) 申请公布日期 2016.05.16
申请号 JP20140212263 申请日期 2014.10.17
申请人 TOYOTA MOTOR CORP 发明人 IWAHASHI YOHEI
分类号 G01R31/26 主分类号 G01R31/26
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