| 发明名称 |
BONDING WIRE FOR SEMICONDUCTOR DEVICE |
| 摘要 |
Provided is a bonding wire capable of satisfying joint reliability, spring performance, and chip damage performance requirements for high density mounting. The bonding wire is characterized by including a total of 0.05-5 at. pcnt of at least one of In, Ga, and Cd, with the remainder being Ag and inevitable impurities. |
| 申请公布号 |
PH12016500383(A1) |
申请公布日期 |
2016.05.16 |
| 申请号 |
PH12016500383 |
申请日期 |
2016.02.26 |
| 申请人 |
NIPPON STEEL AND SUMIKIN MATERIALS CO., LTD.;NIPPON MICROMETAL CORPORATION |
发明人 |
OYAMADA TETSUYA;UNO TOMOHIRO;DEAI HIROYUKI;ODA DAIZO |
| 分类号 |
C22C5/06;C22F1/00;C22F1/14;H01L21/60 |
主分类号 |
C22C5/06 |
| 代理机构 |
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